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SOT-23 WLCSP LEDCSP LED光电一体化模块

FL30P01

FL30P01,P-Channel 30V-WLCSP Power MOSFET


FEATURES
• Power MOSFET Technology
• Ultra Low Qg and Qgd
• High Speed
• Small Footprint 0.677mm × 0.743mm
• Low Profile 0.25mm Height
• Pb Free / RoHS Compliant
• WLCSP Package


APPLICATIONS
• Power Management
• Load Switch
• Battery Protection
• DC/DC Converter
• DSC
• LCD Display
• Load Switch


DESCRIPTION
True wafer level chip-scale packaging is available . The WLCSP package is one-fifty-eight h the footprint of a comparable SOP-8 package and has a profile of less
than 0.42mm. The device has been designed to deliver the lowest on resistance and gate charge in the smallest outline possible with excellent thermal characteristics in an ultra-low profile.



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